导热垫片(DP

产品介绍?DESION

DP-F是一款柔软且具有高形变回复率的缝隙填充导热垫片.其导热系数可达.W/mK.使其可在低压力的情况下表现出较小的热阻.同时排除元器件和电路板之间的空气.并且充分填充各类粗糙的表面.

The?high?rate?of?compliancy?and?softer?of?DP-F?is?a?thermal?conductivity?of?.W/mK.?It?is?ultra-soft?for?low?thermal?resistance?at?very?low?pressures,?and?allows?the?pad?to?fill?in?air?voids?and?air?gaps?between?PC?boards?and?heat?sinks?or?metal?chassic?with?stepped?topography,?rough?surfaces?and?high?stack-up?tolerances.



特点与优势?FEATURES?AND?BENEFITS

◆热传导率可达.W/mK

Thermal?conductivity?.W/mK

◆广泛应用于高回复情况下

Designed?for?high?recovery?rate?applications

◆优异的自粘性能

Excellent?adhesive?properties

◆多种满足客户需求的产品.如D系列的玻纤

Varied?application?products?for?customer?which?is?DC?series?and?with?fiber-glass?series



典型应用?APPLICATIONS

◆半导体散热装置

Semiconductors?to?heat?sink

◆通讯设备

Telecommunications?equipment

◆显卡

Graphics?cards

◆记忆存储模块

Memory?modules

◆LED照明设备

LED?solid?state?lighting

◆电源设备

Power?electronics

◆LCD与等离子电视

LCD?and?PDP?flat?panel?TV

操作说明?HANDLING?INFORMATION







.英寸厚度的产品需使用玻纤增强.产品名称以[-FG"后缀.

该产品具有双面自粘性.如需单面粘性产品.可选择后缀为[-D"的产品.

Fiberglass?is?standa?rd?in?.?inch?thicknesses?to?aid?in?handling?and?is?designated?by?the?suffix?[-FG".Material?is?standard?with?both?sides?tacky;?theD?suffix?indicates?only?one?side?is?tacky.

产品规格?CONFIGURATIONS?AVAILABLE

片状产品(标准尺寸=＂*＂和＂*＂)

Sheet?form(Standard?size=＂*＂?and?＂*＂)

模切产品?Die-cut?parts




深圳市威泰博科技有限公司,专业导热解决方案提供商,专业的EMI电磁屏蔽解决方案提供商,FIP点胶加工

地址:深圳市龙华新区民治街道宝山工业区塘水围工业园B栋楼
电话TEL:+?--?//
传真FAX:+?--
网址:http://www.vioetek.com

E-mail:sales@vioetek.com


,新供应信息-尽在五金商机网

如因作品内容、版权和其它问题需要同本网联系的，联系邮箱：pitechan@foxmail.com。