导热垫片(DP

产品介绍DESION

DP-P是一款质软型缝隙填充导热垫片.由于其较软的硬度和较好的韧性.使其可在低压力的情况下表现出较小的热阻.同时排除元器件和电路板之间的空气.并且充分填充各类粗糙的表面.DP-P具有自粘性.可额外涂覆粘胶涂层.操作简便.可重复利用.

DP-P?is?soft?and?perfect?toughness?for?low?thermal?resistance?at?very?low?pressures.And?it?allows?the?pad?to?fill?in?air?voids?and?air?gaps?between?PC?boards?and?heat?sinks?or?metal?chassis?with?stepped?topography,rough?surfaces?and?high?stack-up?tolerances.?DP-P?is?naturally?tacky?for?reuse,?and?can?be?coate?the?adhesive?thing?is?required.



特点与优势FEATURES?AND?BENEFITS

◆?热传导率可达.W/mk

Thermal?conductivity?.W/mk

◆?广泛应用于低压力情况下

Designed?for?low-stress?applications

◆?优异的自粘性能

Excellent?adhesive?properties

◆?多种满足客户需要的产品.如粘性或无粘性系列产品

Varied?application?products?for?customer?which?is?adhesive?or?un-adhesive?series.



典型应用APPLICATIONS

◆?半导体散热装置

Semiconductors?to?heat?sink

◆?通讯设备

Telecommunications?equipment

◆?显卡

Graphics?cards

◆?记忆存储模块

Memory?modules

◆?LED?照明设备

LED?solid?state?lighting

◆?台式电脑.笔记本电脑.网络服务器

Desktop?computers,laptops,servers

◆?电源设备

Power?electronics


操作说明?HANDLING?INFORMATION

该产品具有双面自粘性.如需单面粘性产品.可选择后缀为[-D"的产品.

Material?is?standard?with?both?sides?tacky;?theD?suffix?indicates?only?one?side?is?tacky.




产品规格?CONFIGURATIONS?AVAILABLE

片状产品(标准尺寸=?mm*mm)

Sheet?form(Standard?size=mm*mm)?

模切产品?Die-cut?parts



,新供应信息-尽在五金商机网

如因作品内容、版权和其它问题需要同本网联系的，联系邮箱：pitechan@foxmail.com。