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产品介绍DESION
DP-F是一款高形变回复率的缝隙填充导热垫片.其导热系数可达.W/mk.因为其较软的硬度.使其可在低压力的情况下表现较小的热阻.同时排除元器件和电路板之间的空气.并且充分填充各类粗糙的表面.DP-F具有自粘性.不需要额外涂覆粘胶涂层.
The?high?rate?of?compliancy?of?DP-F?is?a?thermal?conductivity?of?.?W/mk.lt?is?ultra-soft?for
low?thermal?resistance?at?very?lowpressures,and?allows?the?pad?to?fill?in?air?voids?and?air?gaps?between?PC?boards?and?heat?sinks?or?metal?chassis?with?stepped?topography,rough?surfaces?and?high?stack-up?tolerances.DP-F?is?naturally?tacky,and?no?adhesive?coating?is?required.
特点与优势FEATURES?AND?BENEFITS
◆?热传导率可达.W/mk
Thermal?conductivity?.W/mk
◆?广泛应用于低压力情况下
Designed?for?low-stress?applications
◆?优异的自粘性能
Excellent?adhesive?properties
◆?多种满足客户需要的产品.如D系列和玻纤增强系列
Varied?application?products?for?customer?which?is?DC?series?and?with?fiber-glass?series
典型应用APPLICATIONS
◆?半导体散热装置
Semiconductors?to?heat?sink
◆?通讯设备
Telecommunications?equipment
◆?显卡
Graphics?cards
◆?记忆存储模块
Memory?modules
◆?LED?照明设备
LED?solid?state?lighting
◆?电源设备
Power?electronics
◆?LCD和等离子电视
LCD?and?PDP?flat?panel?TV
操作说明?HANDLING?INFORMATION
.英寸厚度的产品需使用玻纤增强.产品名称以[-FG"后缀.
该产品具有双面自粘性.如需单面粘性产品.可选择后缀为[-D"的产品.
Fiberglass?is?standa?rd?in?.?inch?thicknesses?to?aid?in?handling?and?is?designated?by?the?suffix?[-FG".Material?is?standard?with?both?sides?tacky;?theD?suffix?indicates?only?one?side?is?tacky.
产品规格?CONFIGURATIONS?AVAILABLE
片状产品(标准尺寸=＂*＂和＂*＂)
Sheet?form(Standard?size=＂*＂?and?＂*＂)
模切产品?Die-cut?parts
深圳市威泰博科技有限公司,专业导热解决方案提供商,专业的EMI电磁屏蔽解决方案提供商,FIP点胶加工
地址:深圳市龙华新区民治街道宝山工业区塘水围工业园B栋楼
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