产品介绍DESION
DP-FS是一款质软型缝隙填充导热垫片.由于其较软的硬度.使其可在低压力的情况下表现出较小的热阻.同时排除元器件和电路板之间的空气.并且充分填充各类粗糙的表面.
DB-FS?is?recommended?for?low-stress?applica-tions?that?require?a?mid?to?high?thermally?conductive?interface?material.?S-class?is?ultra?soft?for?low?thermal?resistance?at?very?low?pressures,and?allows?the?pad?to?fill?in?air?voids?and?air?gaps?between?PC?boards?and?heat?sinks?or?metal?chassis?with?stepped?topography,?rough?surfaces?and?high?stack-up?tolerances.
特点与优势FEATURES?AND?BENEFITS
◆?热传导率可达.W/mk
Thermal?conductivity?.W/mk
◆?S为超软硬度级别
◆??S-Class?for?ultra?soft?hardess
◆?广泛应用于低压力情况下
Designed?for?low-stress?applications
◆?优异的自粘性能
Excellent?adhesive?properties
典型应用APPLICATIONS
◆?半导体散热装置
Semiconductors?to?heat?sink
◆?通讯设备
Telecommunications?equipment
◆?显卡
Graphics?cards
◆?记忆存储模块
Memory?modules
◆?LED?照明设备
LED?solid?state?lighting
◆?台式电脑.笔记本电脑.网络服务器
Desktop?computers,laptops,servers
◆?电源设备
Power?electronics
◆?LCD和等离子电视
LCD?and?PDP?flat?panel?TV
操作说明?HANDLING?INFORMATION
.英寸厚度的产品需使用玻纤增强.产品名称以[-FG"后缀.
该产品具有双面自粘性.如需单面粘性产品.可选择后缀为[-D"的产品.
Fiberglass?is?standa?rd?in?.?inch?thicknesses?to?aid?in?handling?and?is?designated?by?the?suffix?[-FG".Material?is?standard?with?both?sides?tacky;?theD?suffix?indicates?only?one?side?is?tacky.
产品规格?CONFIGURATIONS?AVAILABLE
片状产品(标准尺寸=＂*＂和＂*＂)
Sheet?form(Standard?size=＂*＂?and?＂*＂)
模切产品?Die-cut?parts
深圳市威泰博科技有限公司,专业导热解决方案提供商,专业的EMI电磁屏蔽解决方案提供商,FIP点胶加工
地址:深圳市龙华新区民治街道宝山工业区塘水围工业园B栋楼
电话TEL:+?--?//
传真FAX:+?--
网址:http://www.vioetek.com
E-mail:sales@vioetek.com
,新供应信息-尽在五金商机网
如因作品内容、版权和其它问题需要同本网联系的，联系邮箱：pitechan@foxmail.com。