产品介绍DESION
DP-F是一款缝隙填充导热垫片.该产品的导热系数可达到.W/mk.并能在低压力的情况下表现出较小的热阻.同时.该产品较为柔软.可充分填充各类表面粗糙度的电子元器件.
DP-Fis?a?thermally?conductive,reinforced?material?rated?at?a?thermal?conductivity?of?.W/mk,low?thermal?resistances?can?be?achieved?at?low?pressures.This?soft?interace?pad?conforms?well?to?minimal?pressure,resulting?in?excellent?interfacing?and?wet-out?characterstics,even?to?surfaces?with?high?roughness?and/or?topogrphy.
特点与优势FEATURES?AND?BENEFITS
◆?热传导率可达..W/mk
Thermal?conductivity?.W/mk
◆?高柔顺性
Soft?and?highly?compliant
◆?低压力下就有较低的热阻
Low?thermal?resistance?at?low?pressure
◆?优异的自粘性能
Excellent?adhesive?properties
典型应用APPLICATIONS
◆?半导体散热装置
Semiconductors?to?heat?sink
◆?通讯设备
Telecommunications?equipment
◆?显卡
Graphics?cards
◆?记忆存储模块
Memory?modules
◆?LED?照明设备
LED?solid?state?lighting
◆?台式电脑.笔记本电脑.网络服务器
Desktop?computers,laptops,servers
◆?电源设备
Power?electronics
◆?LCD和等离子电视
LCD?and?PDP?flat?panel?TV
操作说明?HANDLING?INFORMATION
.英寸厚度的产品需使用玻纤增强.产品名称以[-FG"后缀.
该产品具有双面自粘性.如需单面粘性产品.可选择后缀为[-D"的产品.
Fiberglass?is?standa?rd?in?.?inch?thicknesses?to?aid?in?handling?and?is?designated?by?the?suffix?[-FG".Material?is?standard?with?both?sides?tacky;?theD?suffix?indicates?only?one?side?is?tacky.
产品规格?CONFIGURATIONS?AVAILABLE
片状产品(标准尺寸=＂*＂和＂*＂)
Sheet?form(Standard?size=＂*＂?and?＂*＂)
模切产品?Die-cut?parts
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