产品介绍DESION
DP-FL是一款无基材超薄型缝隙填充导热垫片.产品厚度小于mm.其导热系数可达.W/mk,使其可在低压力的情况下表现出较小的热阻.同时排除元器件和电路板之间的空气?.并且充分填充各类粗糙的表面.DP-L适用于空间较小的发热器件领域.且具有自粘性.不需要额外涂覆粘胶涂层.
DP-FL?is?a?no?substrate,ultra-thin?thermal?material?rated?at?a?thermal?conductivity?of?.W/mk,low?thermal?resistances?can?be?achieved?at?low?pressures?and?allows?the?pad?to?fill?in?air?voids?and?air?gaps?between?PC?boards?and?heat?sinks?or?metal?chassis?with?stepped?topography,?rough?surfaces?and?high?stack-up?tolerances.DP-FL?is?applied?to?heating?units?in?narrow?space,and?is?naturally,and?no?adhesive?coating?is?required.
特点与优势FEATURES?AND?BENEFITS
◆?热传导率可达.W/mk
Thermal?conductivity?.W/mk
◆?超薄型
Ultra-thin
◆?低压力下就有较低的热阻
Low?thermal?resistance?at?low?pressure
◆?优异的自粘性能
Excellent?adhesive?properties
典型应用APPLICATIONS
◆?半导体散热装置
Semiconductors?to?heat?sink
◆?通讯设备
Telecommunications?equipment
◆?显卡
Graphics?cards
◆?记忆存储模块
Memory?modules
◆?LED?照明设备
LED?solid?state?lighting
◆?台式电脑.笔记本电脑.网络服务器
Desktop?computers,laptops,servers
◆?电源设备
Power?electronics
◆?LCD和等离子电视
操作说明?HANDLING?INFORMATION
该产品具有双面自粘性.如需单面粘性产品.可选择后缀为[-D"的产品.
Material?is?standard?with?both?sides?tacky;?theD?suffix?indicates?only?one?side?is?tacky.
产品规格?CONFIGURATIONS?AVAILABLE
片状产品(标准尺寸="*"和"*")
Sheet?form(Standard?size="*"?and?"*")
模切产品?Die-cut?parts
深圳市威泰博科技有限公司,专业导热解决方案提供商,专业的EMI电磁屏蔽解决方案提供商,FIP点胶加工
地址:深圳市龙华新区民治街道宝山工业区塘水围工业园B栋楼
电话TEL:+?--?//
传真FAX:+?--
网址:http://www.vioetek.com
E-mail:sales@vioetek.com
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