产品介绍DESION
DP-P是一寺质软型缝隙填充导热垫片.由于其较软的硬度.使其可在低压力的情况下表现出较小的热阻.同时排除元器件和电路板之间的空气.并且充分填充各类粗糙的表面.操作简便.可重复利用.
DP-P?is?recommendes?for?low-stress?applications?that?reauire?a?high?thermally?conductive?interface?material.lt?is?ultra-soft?for?low?thermal?resistance?at?very?low?pressures,?and?allows?the?pad?to?fill?in?air?voids?and?air?gaps?between?PC?boards?and?heat?sinks?or?metal?chassis?with?stepped?topogrphy,rough?surfaces?and?high?stack-up?tolerances.Naturally?tacky,?it?requires?additional?adhesive?coating?by?the?actual?condition.
特点与优势FEATURES?AND?BENEFITS
◆?热传导率可达.W/mk
Thermal?conductivity?.W/mk
◆?高柔顺性
Highly?compliant
◆?低压力下就有较低的热阻
Low?thermal?resistance?at?low?pressure
◆?优异的自粘性能.便于装配
Naturally?tacky?for?easy?assembly
◆?便于操作.可重复利用
Easy?handling?and?converting?process,reusable?special?property.
典型应用APPLICATIONS
◆?半导体散热装置
Semiconductors?to?heat?sink
◆?记忆存储模块
Memory?modules
◆?LED?照明设备
LED?solid?state?lighting
◆?台式电脑.笔记本电脑.网络服务器
Desktop?computers,laptops,servers
◆?LCD和等离子电视
LCD?and?PDP?flat?panel?TV
操作说明?HANDLING?INFORMATION
该产品具有双面自粘性.如需单面粘性产品.可选择后缀为[-D"的产品.
Material?is?standard?with?both?sides?tacky;?theD?suffix?indicates?only?one?side?is?tacky.
产品规格?CONFIGURATIONS?AVAILABLE
片状产品(标准尺寸=?mm*mm)
Sheet?form(Standard?size=mm*mm)?
模切产品?Die-cut?parts
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