导热膏 (DG

产品介绍DESION

DG-是一款以硅树脂基体的高性能的导热膏.被用于散热性要求较高的CPUs.GPUs等芯片组件中.其优良的润湿性可使其迅速填充于界面的微孔中.极大程度的降低界面热阻.DG-性能稳定.在正常储存条件下不会发干发硬.触变性好.利于客户使用.

DG-?is?silicone?matrix?with?high?performance.?lt?is?used?for?CPUs,?GPUs?and?other?chip?components?with?high?cooling?requirements.?With?excellent?wettability,?it?can?be?filled?in?the?micro?interface?quickly,?and?the?interfacial?thermal?resistance?will?be?greatly?reduced.?With?stable?performance,DG-?will?not?dry?and?hard?under?normal?storage?conditions,?performed?well?in?thixotropy?and?customers?using.



特点与优势FEATURES?AND?BENEFITS

◆?热传导率可达.W/mk

Thermal?conductivity?.W/mk

◆?界面润湿性能优良

Excellent?in?screen?print?in?application

◆?可在粗糙界面形成极薄界面层

Thin?bond?lines?on?rough?surfaces

◆?低热阻

Low?thermal?resistance

◆?易重工

Easy?to?apply?and?re-work



典型应用APPLICATIONS

◆?半导体和散热器之间热传导

Semiconductors?to?hear?spreader

◆?电源电阻器与底座之间的热传导

Chassis?walks?to?power?resistor

◆?CPU.GPU与散热器之间的热传导

CPU.GPU?to?heat?spreader

◆?PC.NB.LED.功率电源.通信产品的热传导

PC,NB,power?electronics,?telecommunications?equipment

◆?LED发热体的界面热传导

LEDs,Heat?parts

操作说明?HANDLING?INFORMATION

清洁待涂面.除去油污.然后将导热膏直接均匀的涂覆表面即可也可采用点涂.刷涂或钢网印刷的方式进行涂覆

Printing?the?thermal?grease?on?the?cleaning?surface?of?units?Used?to?Form-ln-Place?,Brushing?and?silk-screen?printing

产品规格?CONFIGURATIONS?AVAILABLE

膏状产品(灌装.针管装)

Paste?form?(Canning?or?Syringe)



深圳市威泰博科技有限公司,专业导热解决方案提供商,专业的EMI电磁屏蔽解决方案提供商,FIP点胶加工

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