产品介绍DESION
是导热相变材料.呈膏体状.相变温度点为℃.用于散热器与功率消耗型电子器件之间.产品具有优异的润湿性和压缩率.通过丝网印刷.涂覆或施胶.可以很方便的填充热源与散热器间的空隙.最大限度的降低热阻力.产品具有高导热率.低热阻抗和优异的可靠性.
,?a?paste,?is?a?thermal?conductive?PCM?(phase?change?materials).The?phase?change?temperature?ofis?℃,which?is?used?be-tween?the?radiator?and?the?power?consumption?electronic?devices.?reduces?the?thermal?resistance?between?the?heater?and?the?cooling?plate?by?screen?printing,brushing?or[Form?in?place"with?excellent?wettabil-ity?and?compression?rate.has?high?thermal?conductivity,low?thermal?resistance?and?excellent?reliability.
特点与优势FEATURES?AND?BENEFITS
◆?热传导率可达.W/mk
Thermal?conductivity?.W/mk
◆?室温时为固体.相变温度点后为液态
Solid?state?at?room?temperature?and?liquid?state?after?phase?change?temperature
◆?触变性强.不流动.可操作性高
High?thixotropy,?no?flowing?and?good?operating
典型应用APPLICATIONS
◆?用于高功率LED.电脑行业CPU等散热要求高的应用
High?cooling?requirements?for?high-power?LED?and?CPU
◆?通信设备.无线机站
Communications?equipment,wireless?stations
◆?功率转换器
Power?converter?RDRAM
◆?存储模块和芯片
RDRAM?memory?module?and?chip
操作说明?HANDLING?INFORMATION
清洁需涂胶产品的表面.可通过丝网印刷或涂胶.点胶等工艺进行操作.填充热源与散热器之间的空隙.
Printing?PCM?material?on?the?cleaning?surface?of?unit?by?screen?printing,brushing?or?[Form?in?place",filling?the?gap?between?the?heat?parts.
产品规格?CONFIGURATIONS?AVAILABLE
膏状产品(灌装.针管装)
Paste?form?(Canning?or?Syringe)
深圳市威泰博科技有限公司,专业导热解决方案提供商,专业的EMI电磁屏蔽解决方案提供商,FIP点胶加工
地址:深圳市龙华新区民治街道宝山工业区塘水围工业园B栋楼
电话TEL:+?--?//
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网址:http://www.vioetek.com
E-mail:sales@vioetek.com
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