应用方法?Handling?instruction
为了确保被灌封的电子设备的持久性能.灌封前应该彻底清理元器件表面的灰尘.湿气.油污.以免引起电性能失效以及与被灌封部位低的附着力.混合物应该进行真空脱泡.以排除所有的空气后灌封.
Electronic?devices?must?be?cleaned?so?as?to?avoid?the?failure?of?electrical?property?and?adhesive?force?due?to?the?dust?and?oil?contamination?on?the?surface.?The?mixture?should?be?degassed?by?vacuum?action?then?to?encapsulate.
特点与优势Features?and?Benefits
双组份室温或加热固化的环氧灌封胶.导热性能由低到高可选择.绝缘密封性强.高粘度产品适合导热粘接,低粘度产品适合导热灌封.
Thermal?conductive?adhesives?have?been?high?adhesive?strength?when?the?units?can?be?fix?after?fast?full-curded,and?perfest?thermal?conductivity?and?electrical?insulation.
应用领域?Applications
户外LED散热器件的灌封与粘接
LED?heat?sink?device?outdoor
温度传感器的灌封
Temperature?transmitter
功率管与原器件的灌封与热传导
Power?tube?and?electronic?devices?
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