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有机硅灌封胶



应用方法?Handling?instruction

仔细清除密封表面上的磕碰.毛刺.使用部位应该清除油污并清洗.使用过程中避免与含有N.S.P元素的有机物接触.建议使用德邦R高效金属清洗剂SC.混合:将A,B组分混合均匀.必要时需采用真空脱泡.(A.B组分底部可能会有部分沉降.混合前注意搅匀)浇注:混合好的应在操作时间内用完.否则粘度升高.无法浇注.

Firstly,the?surface?of?units?should?be?treated,?including?burr?and?oil?Contamination.?Note,the?product?must?be?avoid?to?expose?the?organic?material?that?contains?elements?N,S?and?P.lt?is?better?to?use?Darbond?metal?cleaner?SC.Part?A?and?B?should?be?mixed?uniformity,?vacuum?deformation?is?option.(Part?A?and?B?should?be?mixed?before?using?because?there?may?be?some?sediment.)The?operation?process?must?be?finished?within?working?time,otherwise?hard?to?potting?because?of?high?viscosity.



特点与优势Features?and?Benefits

导热率由中到高可选,有机硅基双组份液态胶,室温或加热固化.无腐蚀可重工.

Thermal?conductivity?ranges?from?low?to?high?level;?Two?parts?of?liauid?silicone;cured?at?room?temperature?or?heating;?easily?re-work?and?non-corrosiveness



应用领域?Applications

LED或电子元器件灌封

LED?or?electronic?units

电源模块的封装和灌封

Power?module






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